| Conversion principle | High-frequency switching by semiconductors, usually in modules | Controlled rectification synchronized to the grid, in single-phase or three-phase topologies | Accepted technology or required performance |
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| Power density | Usually high | Usually lower for the same power | Available space, access, and maximum dimensions |
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| Modularity | Naturally favorable to modules in parallel | Can operate in parallel, but is usually configured in larger sets | N, N+1, 2 × 100%, or another philosophy |
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| Maintenance | Fast module swap can reduce MTTR | Maintenance of assemblies and internal components by a technical team | Spare-parts strategy and allowable repair time |
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| Expansion | Adding modules can be planned in the project | Expansion usually requires assessing the architecture, buses, and cooling | Initial capacity and physical/electrical reserve |
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| Efficiency | Tends to be high | Depends on topology, power, and operating point | Minimum efficiency and measurement conditions |
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| Power factor and THDi | Usually favorable in architectures with active correction | Depend on the pulse number, load, transformer, and filters | Limits at the connection point and load range |
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| Output ripple | Usually low due to switching frequency and filtering | Controlled by topology and output filter | RMS/peak-to-peak limit and condition with/without battery |
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| Ventilation | Modules frequently use forced ventilation | Can allow natural ventilation at certain power levels | Temperature, airflow, redundancy, and fan replacement |
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| Input transformer | Can be external, integrated, or omitted depending on architecture | Commonly integrated in industrial solutions | Galvanic isolation, shielding, ratio, and thermal class |
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| Current ranges | Wide and scalable by modules | Particularly suited to high currents and custom projects | Continuous current, recharge, overload, and expansion |
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| Construction customization | High at the system and cabinet level | Traditionally broad in topology, panel, and accessories | IP rating, paint, cable entry, segregation, and dimensions |
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| Typical best fit | Modularity, efficiency, compactness, and expansion | High current, custom industrial architecture, and traditional requirements | The final decision must be validated by the project |
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